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當(dāng)前位置：首頁 > 產(chǎn)品展示 > 封裝及檢測設(shè)備 > 芯片貼片機(jī) > 超高精度倒裝芯片貼片機(jī) CB-700
簡要描述：超高精度倒裝芯片貼片機(jī) CB-700特點(diǎn)：? Ultra-low load, high-accuracy bonding? Real-time control is possible in the low load range. As a result, bump height variation become minimized.
產(chǎn)品型號(hào)：廠商性質(zhì)：生產(chǎn)廠家更新時(shí)間：2024-11-07訪 問 量：1732詳細(xì)介紹
| 功能：貼片應(yīng)用：倒裝焊 特點(diǎn)： • Ultra-low load, high-accuracy bonding • Real-time control is possible in the low load range. As a result, bump height variation become minimized. • Supports ultrasonic bonding by exchanging tools • Available process: ACF、ACP、NCF、NCP、Au-Sn (Eutectic),Au-Au (Ultrasonic),Solder Standard Item & Optional Items [Standard Items] • Flip chip unit • Constant heat stage • ATC（Automatic ceramic tool change) • Calibration • Process management(logger/export to another PC) • Automatic leveling mechanism • ID Reading ＜Optional Items＞ • Eutectic head ( No heating) • Eutectic purge jig • Eutectic stage (52mm pulse heater) • Transfer function( Flux, Paste) • Dispenser unit (except dispenser) • Die bonding • Chip imaging camera • Gel pack • Ultrasonic bonding |
超高精度倒裝芯片貼片機(jī) CB-700
項(xiàng)目 | 規(guī)格參數(shù) |
芯片尺寸 | 0.3x0.3~30X30mm |
基板尺寸（W X L) | 200X200 mm 基板 或8英寸 晶圓 |
邦定力度 | 長負(fù)載范圍：0.049~4.9N 高負(fù)載范圍：4.9~1000N |
貼片精度 | ±0.5[μm](3σ) |
貼片平臺(tái) | 恒溫加熱臺(tái) RT ~ 250℃ |
設(shè)備尺寸 | 1320（W） X 2120（D） X 1815（H）mm |
超高精度倒裝芯片貼片機(jī) CB-700
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